ERS electronic will be attending and presenting at this year’s SYNAPS (Symposium by Yole Développement and NCAP on Advanced Packaging for Semiconductors), which takes place online from May 18th to 20th.
Our Fan-out Equipment Business Unit manager Debbie-Claire Sanchez will present our latest research on Fan-out Wafer Level Packaging, titled “Warpage Response of Thermal Debonding with Tri-Temperature Treatment on Different FOWLP Layouts”, conducted together with IME (Institute of Microelectronics) in Singapore.
Don’t miss out!