Semi-automated Warpage Adjustment

The MWAT300 is a semi-automated warpage correction tool, specifically designed for research and development laboratories or pilot lines during ramp up of a new technology.

Description

The ERS MWAT300 System is designed for semi-automated warpage adjustment of a molded, reconstituted wafer, especially in the style of the eWLB technology but also for similar fan out wafer level package techniques.

It offers a PLC controller with storage capability of more than 100 recipes. The heart of the machine is the proprietary ERS TriTemp Slide. It provides advanced thermal conditioning of the warped wafer in order to significantly and permanently improve the shape of the wafer.

An optional oxygen free TriTemp Slide can be provided for oxidation sensitive wafers, for examples after application of a redistribution layer.

This tool is specifically designed for research and development laboratories or pilot lines during ramp up of a new technology.

Features

– Molded FOWLP wafer warpage control

– Large recipe storage

– Optional oxygen free environment

– MMI with touch screen

MWAT300

Technical data

Wafer Size
300 mm
Maximum Input Warpage
+/- 5mm
Warpage Adjust Method
ERS TriTemp Slide
Typical Output warpage
< 500µm
UPH
Up to 25 depending on product
Temperature Control
DC PID and ERS AirCool® components
Temperature Range
-10°C up to +260°C (depending on station)
Oxygen Free Environment
Optional

Dimensions

W x D x H
2000mm x 1120mm x 1600mm
Weight
500kg

Facility Supply

Voltage
400 VAC 3-phase 32A
Frequency
50 / 60 Hz
Power
12 kW
CDA Pressure
6 bar at 0 °C dew point
CDA Flow Rate
1000 l/min peak
Vacuum Pressure
100 mbar
Vacuum Flow Rate
100 l/min
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