Semi-automated Debonding

The MDM300 is a semi-automated debonding station, specifically designed for research and development laboratories or pilot lines during ramp up of a new technology.

Description

The ERS MDM300 System is designed for semi-automated separation of wafer and carrier related to the eWLB technology („debonding“). Debonding for thermal release bonding agents is performed. The system provides high repeatability of results with respect to the quality of the debonded wafer.

It offers a semi-automatic PLC controller with storage capability of more than 100 recipes. The machine is capable of an automated debond process with preset parameters. After that, the tape can be removed manually. Then, an automated warpage adjust sequence is performed.

The machine comes with two operation modes: Debonding and warpage adjust as well as warpage adjust only. An optional oxygen free TriTemp Slide can be provided for oxidation sensitive wafers, for example after application of a redistribution layer.

This tool is specifically designed for research and development laboratories or pilot lines during ramp up of a new technology.

Features

– eWLB optimized thermal debonding

– eWLB wafer warpage control

– Warpage adjust only mode

– MMI with touch screen

MDM300

Technical data

Wafer Size
300 mm
Debond System
Thermal
Warpage Adjust Method
ERS TriTemp Slide
Typical Output warpage
< 500µm
Temperature Control
DC PID and ERS AirCool® components
Temperature Range
-10°C up to +260°C (depending on station)
Oxygen Free Environment
Optional

Dimensions

W x D x H
2000mm x 1050mm x 1600mm
Weight
600kg

Facility Supply

Voltage
400 VAC 3-phase 32A
Frequency
50 / 60 Hz
Power
15 kW
CDA Pressure
6 bar at 0 °C dew point
CDA Flow Rate
1000 l/min peak
Vacuum Pressure
100 mbar
Vacuum Flow Rate
100 l/min
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