In 1970, our founder Erich Reitinger invented the first thermal chuck for wafer probing, which has since become an industry staple. Today, ERS is still at the forefront of thermal technology, and constantly pushing the limits of what‘s possible.

Temperature and its regulation continue to be key parameters in wafer test, and as new and more intricate semiconductor applications are being developed, thermal management is more important than ever before. To address the common challenges in temperature wafer test, ERS has leveraged its 50 years of experience to develop the following solutions: