High Thermal Uniformity Chuck System
Fully integrated hot/cold solutions for all major production and laboratory wafer probers.
- Available in 200 mm and 300 mm wafer format
- Thermal Uniformity of ±0,1°C
- Temperature stability of ±0,03°C
- Temperature display accuracy of ±0,05°C
DESCRIPTION
The AC3 High Thermal Uniformity (HTU) chuck system is a breakthrough device that has introduced High Thermal Uniformity and Accuracy in wafer testing.
It is the ideal tool for the probing of the new generation of temperature-sensitive sensors and high precision analog devices. The HTU’s unparalleled precision in temperature management allows for more accurate sensing values such as gas concentration, humidity, and pressure.
The innovative HTU Aircool© chuck system is available now in both 200mm and 300mm wafer formats. They feature a thermal uniformity lower than ±0,1°C, and a temperature control stability better than ±0,03°C.
By pairing the HTU Chuck with ERS’s Dynamic Thermal Shield (DTS), our customers will be perfectly equipped to manage the environmental temperature variation coming from other supporting elements such as the probe card.
TECHNICAL DATA
-20°C to 0°C ≤±0.2°C
0° to +90°C ≤±0.1°C
+90°C to +120°C ≤±0.2°C
+120°C to +200°C ≤±0.5°C
≥ 200°C ≤±0.5°C
- 40 °C to +25°C: 10 min
+25 °C to +150 °C: 20 min
+25 °C to +200 °C: 25 min
+25 °C to +300 °C: 40 min
+200 °C to +25 °C: 35 min
+300 °C to +25 °C: 40 min
+25 °C to 0 °C: 15 min
+25 °C to -40 °C: 35 min
+25 °C to -55 °C: 40 min