ERS ready for imminent eWLB upswing

eWLB (Embedded Wafer-Level Ball Grid Array) is a very economical packaging technology for the advanced semiconductor solutions required for innovative application areas such as Internet of Things, sensors, automation and mobility. It enables semiconductor manufacturers to create chips with smaller footprint, thinner package and better electrical properties than possible with…

ERS awarded ISO 9001:2008 Recertification

ERS awarded ISO 9001:2008 Recertification
TÜV Deutschland, a recognized expert for helping high-tech companies comply with industry standards and regulations, awarded ERS electronic GmbH the ISO9001:2008 recertification. The certification is valid until September 2018.  ISO, the International Organization for Standardization (www.iso.org), is the world’s largest developer and publisher of International Standards established by a membership…
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