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Visit us in San Francisco
July 13-15, 2010
Moscone Center
South Hall, Stand #1831
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ERS automatic production tools support eWLB packaging technology
Multiple ERS eWLB packaging tools sold in Europe and Asia. Repeat orders of both 200mm eWLB and 300mm eWLB production tools received in 2010.
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ERS Thermal Wafer Chucks
Our product portfolio consists of various Chuck Systems which can be integrated into Manual Probers, Semi and Fully Automated Probers. All products come in 6”, 8” or 300mm versions.
The precision of ERS Chuck Systems will enable the most accurate results with Parameter Testing, fA testing, RF Testing, CV Measurements and many more applications.
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AirCool Chuck SystemAirCool utilizes pressurized air inside the chuck to cool.
- No liquids and peltier elements
- MTBF > 35,000 hours
- Temperature ranges from
-30 to +400 °C
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AirCool plus Chuck SystemRevolutionary system with a minimum footprint.
- No liquids and peltier elements
- Patented Chuck/Chiller combination
- Temperature ranges from
-65 to +300 °C
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PowerSense Chuck SystemThe Answer to ever faster and smaller semiconductors.
- Up to 5000W energy dissipation
- Most efficient heat transfer
- Temperature ranges from
-55 to +200 °C
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WaferTherm Chuck SystemThis liquid cooled system allows enormous temperature precision.
- 0.01 °C temperature step precision
- Liquid cooled Chuck System
- Temperature ranges from
-65 to +150 °C
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