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Visit us in San Francisco
July 13-15, 2010
Moscone Center
South Hall, Stand #1831
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ERS automatic production tools support eWLB packaging technology
Multiple ERS eWLB packaging tools sold in Europe and Asia. Repeat orders of both 200mm eWLB and 300mm eWLB production tools received in 2010.
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ERS defends AirCoolŽ Plus and PowerSenseŽ patents
The technology behind the ERS AirCoolŽ Plus (DE 10216786) and PowerSenseŽ (DE 10 2005 001 163) retains patent protection in Munich court decisions.
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ERS recertified for NRTL
ERS electronic GmbH NRTL listing reconfirmed for 2009
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ERS awarded ISO 9000 Recertification.
In February 2009, ERS electronic GmbH earned recertification of its ISO 9001:2000 quality management system.
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Semicon West 2009 Report
ERS at the "compact" Semicon West 2009 (July 14-16)
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Semicon Singapore 2009 Report
ERS/Miraq Present New ERS Technology at Semicon Singapore 2009 (May 20-22)
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ERS News
ERS America opens in North Carolina
ERS opens service office in Dresden
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Further Information
Please contact us for further information.
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ERS continued delivering automatic production and engineering tools supporting the eWLB chip package process developed in Europe and adopted by major players in the semiconductor packaging industry. Half of the ERS eWLB equipment sales made to date were to locations in Asia. The first fully-automatic tool deliveries of the ADM200 Automatic Wafer Debonding Machine began in 2008 followed by the WAT200 eWLB Warpage Adjust Tool in early 2009. Repeat orders of the 200mm eWLB tools as well as the first delivery and repeat order of 300mm eWLB tools followed in 2010.