Starting where others quit

Designing and building new tools for both test and production
based on a broad range of high-tech ERS thermal solutions

WAT 200 Warpage Adjustment Station

As the eWLB fan-out wafer level package technology was being developed into a full production process, a need arose for an automatic warpage adjustment tool for the debonded eWLB wafers.  ERS met the challenge and developed the WAT200 Automatic Warpage Adjust Tool.  This tool was of strategic importance as new processes with difference substrate strengths and form factors were being qualified.


ADM
Wafer Size 200mm
Handling System 3-Axis Robot
Throughput 20-30 UPH depending on product and operation mode
Temperature Control DC PID and AirCool®
Temperature Range +20°C up to +240°C (depending on station)
Input Station 2 Cassettes, 13 or 25 slot
Output Station 2 Cassettes, 13 or 25 slot
Dimensions (W x D x H) 1744 x 1250 x 1741 mm
Weight 1000kg

Facility Supply

Voltage 400 VAC 3-phase
Frequency 50 / 60 Hz
Power 8 kW
CDA Pressure 6 bar at 0°C dew point
CDA Flow Rate 400 l/min, 800 l/min peak
Nitrogen Supply Pressure 6 bar
Nitrogen Purge Flow Rate 100 l/min, 200 l/min peak
Vacuum Pressure 100 mbar
Vacuum Flow Rate 100 l/min
 
 
 

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