Meet with us in Munich
February 26-28, 2012
Hotel Kempinski Vier Jahreszeiten, Munich, Germany
Test at Temperature, Thermal Wafer Chucks
AirCool®3 modular chuck system
Offering cold temperature test with a minimum footprint and air-only reliability.
- No liquids or Peltier elements used for cooling
- Modular System, compatible through all upgrade options
- Temperature ranges from
-65°C to +400°C
PowerSense® chuck system
Extremely fast removal of heat added to the device under test to hold the target temperature.
- Up to 5000W energy dissipation
- Most efficient heat transfer
- Temperature ranges from
-55 to +200 °C
WaferTherm® chuck system
A liquid-cooled system providing the high precision necessary for LCD test.
- 0.01 °C temperature step precision
- Liquid-cooled Peltier chuck system
- Temperature ranges from
-55 to +150 °C
Why to choose an ERS chuck system?
As a quality and technology market leader ERS has a clear statement for product features: Uncompromised excellence in all disciplines.
Further Testing Applications
AirCool®3 Package Level
Final Test application of the famous ERS AirCool®plus thermal system that uses only air for cooling. This clean, green system can be integrated into both MEMS motion sensor stimulus units as well as into static test handlers.
- No Nitrogen needed for cooling
- Temperature ranges from -55 to +200 °C
Current events at ERS
© ERS electronic GmbH | Thermal wafer chucks | Solutions for the semiconductor industry | imprint | home | login