Visit us in Manila
June 6-8, 2012
SMX Convention Center, Pasay City (Metro Manila)
Hall 1, Booth 147
ERS® AirCool®3 Package Level
The ERS AirCool®3 Package Level Thermal System is the logical choice for final test thermal applications where previously the only choice was the use of liquid nitrogen. It has already proved successful for challenging applications such as MEMS handlers. As a new adaptation of the world-famous AirCool®plus thermal system, the Package Level system has built-in reliability as well as being air-clean and air-green. The significance of air-only cooling to reliability is obvious when compared to the alternatives of liquid coolants, Peltiers and liquid nitrogen.
The patented AirCool®plus chiller system combines highly efficient cooling technologies with automatic control of environment conditions for cold testing.
| Temperature Range | -40°C to +150°C |
| Extended Temperature Ranges | Available as option |
| Coolant | Air, user-supplied |
| Chiller Dimensions | 422 mm x 500 mm x 1020 mm |
| Power Consumption | Approx. 2800 VA |
Discuss your target applications of the AirCool®3 Package Level system with us!
June 6-8, 2012
SMX Convention Center, Pasay City (Metro Manila)
Hall 1, Booth 147
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