Mastering the 5th dimension

Bringing an awareness of thermal influence in test and
production and the experience to deal with its challenges

Applied Thermal Excellence

Over 40 years of  empirical research and applied thermal development means that we are not only able to solve problems that can be calculated, but also those that are only recognized intuitively.  Our experienced design engineers predict mechanical and electrical influences related to temperature before simulation programs or prototypes confirm them.

Temperature - the Key to Mechanical Precision and Electrical Performance

As with all high-tech industries, the tools for the manufacturing and testing of semiconductor devices have had to meet specifications for mechanical precision and electrical performance that become ever stricter.  Simultaneously, production efficiency demands ever-larger substrate sizes and ever-shrinking critical dimensions.  ERS engineers understand the interplay of temperature, mechanical precision and electrical performance to a degree seldom found elsewhere in the industry.

Solutions Conceived, Tested and Manufactured in House

Over 95% of the production process of ERS thermal chuck systems can be accomplished within the walls of our factory near Munich, Germany.  CAD designs from our engineering department are sent through the ERS network to control CAM machine tools making same-day protoyping a reality.  The built-in quality of new products is a result of the proximity of the design engineer to the production floor.  Qualified local sub-vendors are used later to control costs and reduce lead times once the system is mature.

Investing in Future Technology

Development engineers make up over 25% of the ERS work force.  Located in its own building at the ERS factory, the well-trained engineering team has access to state-of-the-art thermal imaging tools and the software tools in use throughout the industry.

Innovation Examples

Patented AC2 Chilling Technology

AC

ERS has successfully defended the patent on this important and widely sold (over 500 units in the field world-wide) air-only chilling system.  This technology not only provides the maximum possible chilling effect in a surprisingly compact unit but also makes use of the same coolant air as the dry-air purge in the test chamber.

 

Wafer Testing at 0° C – without Chiller - The AirCool® Zero

AC2

Building on the original solid-state, air-only cooling system used in the original AirCool® thermal chuck system that took the  market by storm in the early 1990's, ERS now offers a 0°C system smaller than any similarly powerful system - all without moving parts.  The cooling unit is so compact that a true no-footprint integration is possible.

 
 
 
 

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