15.02.2012: ERS displayed sub-zero module of its new AirCool®3 System in Tokyo
ERS presented its new wafer thermal
test system - the ERS AirCool®3 - during the Semicon Japan 2011. The
AirCool
News at ERS
15.02.2012: ERS displayed sub-zero module of its new AirCool®3 System in Tokyo
ERS presented its new wafer thermal test system - the ERS AirCool®3 - during the Semicon Japan 2011. The AirCool®3 combines the advantage of the two ERS flagship products - AirCool® and AirCool®plus in one modular system. As with the other ERS AirCool® products, the AirCool®3 exclusively uses air for cooling and is designed to be quickly and easily upgradeable on site. Adaptations for the AirCool®3 are available for all major wafer prober models.
Further news
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11.10.2011: ERS introduces AirCool®3 at Semicon Europa 2011
ERS announces the ERS AirCool®3, its new wafer thermal test system: another ERS milestone for performance, reliability and flexibility in thermal wafer probing. The AirCool®3 is ERS’s third-gen...
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30.04.2011: ERS Receives eWLB Patent in Singapore
Singapore became the second country to grant the ERS patent for eWLB debonding and warpage adjust methods.
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10.03.2011: ERS Launches FOWLP Global Competence Center
Munich - ERS electronic GmbH recently announced the lauching of its competence center for new process development on eWLB and other Fan-Out Wafer Level Packaging (FOWLP) technologies.
With its competence b...
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10.03.2011: ERS Receives eWLB Patent in Japan
Japan became the first country to grant the ERS patent for eWLB debonding and warpage adjust methods.
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10.06.2010: Shipment of the ADM300 Debonding System
The ERS ADM300 is not only the first successful automatic 300mm eWLB debonding tool for the high-performance eWLB package - it also represents the most mature technology on the market. The operation of the ADM300 is...
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28.05.2010: ERS awarded ISO 9001:2008 Recertification
TÜV Deutschland, a recognized expert for helping high-tech companies comply with industry standards and regulations, awarded ERS electronic GmbH the ISO9001:2008 recertification. The certification is valid until Feb...
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17.12.2008: ERS defends AirCool® Plus and PowerSense® patents
In December of 2008, ERS successfully defended its AirCool® Plus and PowerSense® patents against challenges made before a court in Munich, Germany. The AirCool® Plus patent protects ...
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Industry Exhibitions and Conferences
ERS exhibits at or attends exhibitions and conferences all around the world. If you plan to visit one of these events we would like to invite you to schedule an appointment.
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Meet with us in Munich
February 26-28, 2012
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Hotel Kempinski Vier Jahreszeiten, Munich, Germany
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Meet with us in San Diego
SW Test Workshop 2012, June 10-13, 2012
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Rancho Bernardo Inn, San Diego, CA, -
Visit us in San Francisco
Semicon West 2012, July 10-12, 2012
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San Francisco Moscone Center , South Hall, Booth #530 -
Visit us in Taipei
Semicon Taiwan 2012, September 5-7, 2012
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Nangang Exhibition Hall, -
Visit us in Dresden
Semicon Europa 2012, October 9-11, 2012
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Messe Dresden, Hall 1, Booth #1.234 -
Meet with us in San Jose
International Wafer Level Packaging Conference 2012, 5-8 November, 2012
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Doubletree by Hilton Hotel, San Jose CA,
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