ERS presented its new wafer thermal test system - the ERS AirCool®3 - during the Semicon Japan 2011. The AirCool®3 combines the advantage of the two ERS flagship products - AirCool® and AirCool®plus in one modular system. As with the other ERS AirCool® products, the AirCool®3 exclusively uses air for cooling and is designed to be quickly and easily upgradeable on site. Adaptations for the AirCool®3 are available for all major wafer prober models.
ERS announces the ERS AirCool®3, its new wafer thermal test system: another ERS milestone for performance, reliability and flexibility in thermal wafer probing. The AirCool®3 is ERS’s third-gen...
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Singapore became the second country to grant the ERS patent for eWLB debonding and warpage adjust methods.
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Munich - ERS electronic GmbH recently announced the lauching of its competence center for new process development on eWLB and other Fan-Out Wafer Level Packaging (FOWLP) technologies.
With its competence b...
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Japan became the first country to grant the ERS patent for eWLB debonding and warpage adjust methods.
The ERS ADM300 is not only the first successful automatic 300mm eWLB debonding tool for the high-performance eWLB package - it also represents the most mature technology on the market. The operation of the ADM300 is...
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TÜV Deutschland, a recognized expert for helping high-tech companies comply with industry standards and regulations, awarded ERS electronic GmbH the ISO9001:2008 recertification. The certification is valid until Feb...
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In December of 2008, ERS successfully defended its AirCool® Plus and PowerSense® patents against challenges made before a court in Munich, Germany. The AirCool® Plus patent protects ...
read more ERS exhibits at or attends exhibitions and conferences all around the world. If you plan to visit one of these events we would like to invite you to schedule an appointment.
February 26-28, 2012
Hotel Kempinski Vier Jahreszeiten, Munich, Germany
SW Test Workshop 2012, June 10-13, 2012
Rancho Bernardo Inn, San Diego, CA,
Semicon West 2012, July 10-12, 2012
San Francisco Moscone Center , South Hall, Booth #530
Semicon Taiwan 2012, September 5-7, 2012
Nangang Exhibition Hall,
Semicon Europa 2012, October 9-11, 2012
Messe Dresden, Hall 1, Booth #1.234
International Wafer Level Packaging Conference 2012, 5-8 November, 2012
Doubletree by Hilton Hotel, San Jose CA,
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